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Automatic Optical Inspection System with Telecentric Optics and Phasemeasuring Profilometry for Highly Accurate Localization of Electronic Packages
Year of publication
2020
Author
Hyunki Lee, Min Young Kim
Journal
INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS
volume
18
Issue
8
Page
2120-2130
File
첨부 Lee-Kim2020_Article_AutomaticOpticalInspectionSyst.pdf (3.5M) 0회 다운로드 DATE : 2020-09-11 11:20:31

Typical visual placement inspection systems in semiconductor or electronics manufacturing industries use only highly-magnified two-dimensional imaging with controlled illumination for high accuracy. However, current semiconductor packaging technology needs more precise manufacturing processes for highly integrated semiconductor packages, in which high-precision alignment between the semiconductor die and the matched substrate is indispensable for successful electronic interconnection. To solve this problem, an advanced visual placement inspection system for 3D stacking of electronic components is proposed; it utilizes 3D profilometry and 2D telecentric optics. In addition to the introduction of the proposed system, the system calibration algorithms and the information processing algorithms for accurate positioning of the semiconductor die, as well as the implemented inspection system are described in detail. To verify the system performance, a series of real experiments on newly developed flip-chip packages for high-performance computing were performed, and the results are analyzed and discussed. 



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