The invention of extracting, the screen comprising: receiving a fiducial information from the printer device, the location information and the location information of the solder pads formed on the substrate through the measurement of the solder inspection equipment as for the correction method of the stencil mask of the screen printer equipment step, the using the location information and the location information of the solder pads step of estimating the x, y offset values ​​and a rotating amount of the stencil mask relative to the fiducial information, and the x, y offset values ​​and a rotating amount of the stencil mask and a step of passing a screen printer equipment. In this way, based on the fiducial information transmitted from the screen printer equipment to estimate the x, y offset values ​​and a rotating amount of the stencil mask in the solder inspection device, by feeding back the estimate value with a screen printer equipment by performing position correction of the stencil mask , it is possible to improve the reliability of the solder printing.